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2025-02-11 |
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Printed circuit board |
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Package substrate |
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2021-08-10 |
| 10991647 |
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| 10849225 |
Printed circuit board |
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2020-11-24 |
| 9736939 |
Printed circuit board and method of manufacturing printed circuit board |
Suk Hyeon Cho, Yong Ho Baek, Young Gwan Ko, Young Kuk Ko |
2017-08-15 |
| 9736927 |
Printed circuit board and method of manufacturing the same |
Suk Hyeon Cho, Young Gwan Ko, Yong Ho Baek, Young Kuk Ko |
2017-08-15 |
| 9060458 |
Method for manufacturing multi-layer printed circuit board |
Cheol Ho Choi |
2015-06-16 |
| 8151446 |
Apparatus for manufacturing printed circuit board |
Jee-Soo Mok, Je-Gwang Yoo, Jong Seok Bae, Chang-Sup Ryu |
2012-04-10 |
| 7973248 |
Printed circuit board using paste bump and manufacturing method thereof |
Jee-Soo Mok, Chang-Sup Ryu, Eung-Suek Lee, Youn-Soo Seo, Hee-Bum Shin +3 more |
2011-07-05 |
| 7859106 |
Multilayer printed circuit board using paste bumps |
Chang-Sup Ryu, Dong-Jin Park, Jee-Soo Mok, Byung-Bae Seo |
2010-12-28 |
| 7622329 |
Method for fabricating core substrate using paste bumps |
Chang-Sup Ryu, Dong-Jin Park, Jee-Soo Mok, Byung-Bae Seo |
2009-11-24 |
| 7169707 |
Method of manufacturing package substrate with fine circuit pattern using anodic oxidation |
Duck Young Maeng, Byung-Kook Sun, Tae Hoon Kim, Jee-Soo Mok, Jong-Suk Bae +2 more |
2007-01-30 |
