Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8535547 | Printed circuit board manufacturing system and manufacturing method thereof | Chung-Woo Cho, Soon Jin Cho, Ki Young Yoo, Seok Hwan AHN | 2013-09-17 |
| 7973248 | Printed circuit board using paste bump and manufacturing method thereof | Jee-Soo Mok, Chang-Sup Ryu, Eung-Suek Lee, Youn-Soo Seo, Hee-Bum Shin +3 more | 2011-07-05 |
| 7859106 | Multilayer printed circuit board using paste bumps | Yoong Oh, Chang-Sup Ryu, Dong-Jin Park, Jee-Soo Mok | 2010-12-28 |
| 7622329 | Method for fabricating core substrate using paste bumps | Yoong Oh, Chang-Sup Ryu, Dong-Jin Park, Jee-Soo Mok | 2009-11-24 |