Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9240365 | Cooling device and electronic device | Katsuya Tsuruta | 2016-01-19 |
| 8988882 | Heat sink package and method of manufacturing | Rinkou Fukunaga, Katsuya Tsuruta, Kei Mizuta, Masamichi Ishihara | 2015-03-24 |
| 8982559 | Heat sink, cooling module and coolable electronic board | Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta | 2015-03-17 |
| 8611089 | Heat pipe and circuit board with a heat pipe function | Kei Mizuta, Katsuya Tsuruta, Toshiaki Kotani | 2013-12-17 |
| 8534348 | Heat pipe and method for manufacturing same | Katsuya Tsuruta | 2013-09-17 |
| 7374104 | Memory card | Yoshitaka Aoki, Hideaki Bando, Keiichi Tsutsui, Hirotaka Nishizawa, Takashi Totsuka | 2008-05-20 |
| 6838368 | Method for making semiconductor device using a nickel film for stopping etching | Tomoshi Ohde | 2005-01-04 |
| 6563202 | Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus | Hidetoshi Kusano, Haruhiko Makino, Hideyuki Takahashi | 2003-05-13 |
| 6514847 | Method for making a semiconductor device | Tomoshi Ohde | 2003-02-04 |
| 6465279 | Lead frame and production method thereof, and semiconductor device and fabrication method thereof | Hidetoshi Kusano | 2002-10-15 |
| 6403402 | Semiconductor chip having an underplate metal layer | Hidetoshi Kusano | 2002-06-11 |
| 6391684 | Lead frame and manufacturing method thereof | — | 2002-05-21 |
| 6369441 | Method of producing a semiconductor chip having an underplate metal layer | Hidetoshi Kusano | 2002-04-09 |
| 6351025 | Semiconductor chip having an underplate metal layer | Hidetoshi Kusano | 2002-02-26 |
| 6340840 | Lead frame and production method thereof, and semiconductor device and fabrication method thereof | Hidetoshi Kusano | 2002-01-22 |
| 6258631 | Semiconductor package and the manufacturing method | Makoto Ito | 2001-07-10 |
| 6240632 | Method of manufacturing lead frame and integrated circuit package | Makoto Ito | 2001-06-05 |
| 6194778 | Semiconductor package with improved cross talk and grounding, and method of manufacturing same | Kazuhiro Sato, Makoto Ito | 2001-02-27 |
| 6140153 | Lead frame, the manufacturing method, semiconductor device and the manufacturing method | Hidetoshi Kusano | 2000-10-31 |
| 6114755 | Semiconductor package including chip housing, encapsulation and the manufacturing method | Makoto Ito | 2000-09-05 |
| 6104091 | Semiconductor package and the manufacturing method | Makoto Ito | 2000-08-15 |
| 6093970 | Semiconductor device and method for manufacturing the same | Makoto Ito, Yasushi Otsuka, Kazuhiro Sato | 2000-07-25 |
| 6078097 | Lead frame | — | 2000-06-20 |
| 6074898 | Lead frame and integrated circuit package | Makoto Ito | 2000-06-13 |
| 6054773 | Semiconductor device and method of manufacturing the same | Kazuhiro Sato, Hiroyuki Shigeta | 2000-04-25 |