Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8988882 | Heat sink package and method of manufacturing | Kenji Ohsawa, Rinkou Fukunaga, Katsuya Tsuruta, Masamichi Ishihara | 2015-03-24 |
| 8982559 | Heat sink, cooling module and coolable electronic board | Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani | 2015-03-17 |
| 8611089 | Heat pipe and circuit board with a heat pipe function | Katsuya Tsuruta, Toshiaki Kotani, Kenji Ohsawa | 2013-12-17 |