Issued Patents All Time
Showing 1–25 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127657 | Semiconductor device and process for fabricating the same | — | 2021-09-21 |
| 10748840 | Chip-size, double side connection package and method for manufacturing the same | — | 2020-08-18 |
| 10559521 | Semiconductor device and process for fabricating the same | — | 2020-02-11 |
| 10199310 | Semiconductor device and process for fabricating the same | — | 2019-02-05 |
| 9984961 | Chip-size, double side connection package and method for manufacturing the same | — | 2018-05-29 |
| 9887147 | Semiconductor device and process for fabricating the same | — | 2018-02-06 |
| 9812621 | Semiconductor device and fabrication method for same | Kenshu Oyama, Shoji Murakami, Hitonobu Onosaka | 2017-11-07 |
| 9698327 | LED illumination module and LED illumination apparatus | Kenshu Oyama, Shoji Murakami, Hitonobu Onosaka, Masato Shima | 2017-07-04 |
| 9559041 | Semiconductor device and process for fabricating the same | — | 2017-01-31 |
| 9252125 | Stacked semiconductor device and fabrication method for same | Yutaka Kagaya, Hidehiro Takeshima | 2016-02-02 |
| 9093431 | Semiconductor device and process for fabricating the same | — | 2015-07-28 |
| 8988882 | Heat sink package and method of manufacturing | Kenji Ohsawa, Rinkou Fukunaga, Katsuya Tsuruta, Kei Mizuta | 2015-03-24 |
| 8952261 | Interconnect-use electronic component and method for producing same | Minoru Enomoto, Shigeru Nomura | 2015-02-10 |
| 8664666 | Semiconductor device and process for fabricating the same | — | 2014-03-04 |
| 8557700 | Method for manufacturing a chip-size double side connection package | — | 2013-10-15 |
| 8501542 | Double-faced electrode package, and its manufacturing method | Harufumi Kobayashi | 2013-08-06 |
| 8415789 | Three-dimensionally integrated semicondutor device and method for manufacturing the same | — | 2013-04-09 |
| 8399980 | Electronic component used for wiring and method for manufacturing the same | Hirotaka Ueda | 2013-03-19 |
| 8247896 | Stacked semiconductor device and fabrication method for same | Yutaka Kagaya, Hidehiro Takeshima | 2012-08-21 |
| 8154110 | Double-faced electrode package and its manufacturing method | Harufumi Kobayashi | 2012-04-10 |
| 8110911 | Semiconductor chip package with post electrodes | Hirotaka Ueda | 2012-02-07 |
| 8017452 | Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method | Hirotaka Ueda | 2011-09-13 |
| 7944058 | Semiconductor device and process for fabricating the same | — | 2011-05-17 |
| 7884466 | Semiconductor device with double-sided electrode structure and its manufacturing method | Fumihiko Ooka, Yoshihiko Ino | 2011-02-08 |
| 7838983 | Packaged semiconductor device and method of manufacturing the packaged semiconductor device | — | 2010-11-23 |