Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8500984 | Method for manufacturing printed-circuit board | Yoshimi Egawa | 2013-08-06 |
| 8501542 | Double-faced electrode package, and its manufacturing method | Masamichi Ishihara | 2013-08-06 |
| 8154110 | Double-faced electrode package and its manufacturing method | Masamichi Ishihara | 2012-04-10 |
| 6852564 | Semiconductor device and method of fabricating the same | Shinji Ohuchi, Yasushi Shiraishi | 2005-02-08 |
| 6653218 | Method of fabricating resin-encapsulated semiconductor device | Shinji Ohuchi, Yasushi Shiraishi | 2003-11-25 |
| 6573598 | Semiconductor device and method of fabricating the same | Shinji Ohuchi, Yasushi Shiraishi | 2003-06-03 |
| 6495916 | Resin-encapsulated semiconductor device | Shinji Ohuchi, Yasushi Shiraishi | 2002-12-17 |
| 6369440 | Semiconductor substrate and manufacturing method thereof | — | 2002-04-09 |
| 6054757 | Semiconductor apparatus, circuit board and combination thereof | — | 2000-04-25 |
| 5952710 | Semiconductor device and method of manufacturing same | — | 1999-09-14 |