Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8500984 | Method for manufacturing printed-circuit board | Harufumi Kobayashi | 2013-08-06 |
| 8435839 | Method of manufacturing semiconductor device and the semiconductor device | — | 2013-05-07 |
| 8314492 | Semiconductor package and package-on-package semiconductor device | — | 2012-11-20 |
| 8202391 | Camera module and method of manufacturing camera module | — | 2012-06-19 |
| 8143718 | Semiconductor device having stress relaxation sections | — | 2012-03-27 |
| 8138023 | Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof | — | 2012-03-20 |
| 7898086 | Semiconductor device having a package base with at least one through electrode | — | 2011-03-01 |
| 7781880 | Semiconductor package | — | 2010-08-24 |
| 7646086 | Semiconductor package | — | 2010-01-12 |
| 7560302 | Semiconductor device fabricating method | — | 2009-07-14 |
| 7413925 | Method for fabricating semiconductor package | — | 2008-08-19 |
| 7317244 | Semiconductor device and manufacturing method thereof | Yasufumi Uchida | 2008-01-08 |
| 7215031 | Multi chip package | — | 2007-05-08 |
| 7179685 | Fabrication method for stacked multi-chip package | — | 2007-02-20 |
| 7002251 | Semiconductor device | — | 2006-02-21 |
| 6995038 | Method of manufacturing semiconductor device | Akira Sugai | 2006-02-07 |
| 6870249 | Semiconductor device and manufacturing method thereof | — | 2005-03-22 |
| 6867069 | Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin | Kazumi Shinchi, Takeshi Niigaki | 2005-03-15 |
| 6777797 | Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding | — | 2004-08-17 |
| 6635963 | Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin | Kazumi Shinchi, Takeshi Niigaki | 2003-10-21 |
| 6426554 | Semiconductor device | — | 2002-07-30 |
| 6376278 | Methods for making a plurality of flip chip packages with a wafer scale resin sealing step | Kazumi Shinchi, Takeshi Niigaki | 2002-04-23 |
| 6259163 | Bond pad for stress releif between a substrate and an external substrate | Shinji Ohuchi, Noritaka Anzai | 2001-07-10 |
| 6251704 | Method of manufacturing semiconductor devices having solder bumps with reduced cracks | Shinji Ohuchi, Noritaka Anzai | 2001-06-26 |
| 6229215 | Semiconductor device and manufacturing method thereof | — | 2001-05-08 |