Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867069 | Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin | Yoshimi Egawa, Takeshi Niigaki | 2005-03-15 |
| 6635963 | Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resin | Yoshimi Egawa, Takeshi Niigaki | 2003-10-21 |
| 6376278 | Methods for making a plurality of flip chip packages with a wafer scale resin sealing step | Yoshimi Egawa, Takeshi Niigaki | 2002-04-23 |