Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8288715 | Oxygen detection method, air leakage determination method, gas component detection device, and vacuum processing apparatus | Toyoaki Nakajima, Takeshi Miyashita, Yasushi Nagata, Hideki Yoshizawa | 2012-10-16 |
| 8044518 | Junction member comprising junction pads arranged in matrix and multichip package using same | — | 2011-10-25 |
| 7435626 | Rearrangement sheet, semiconductor device and method of manufacturing thereof | Yoshihiro Saeki | 2008-10-14 |
| 7317244 | Semiconductor device and manufacturing method thereof | Yoshimi Egawa | 2008-01-08 |
| 6812556 | Multi-chip package semiconductor device having plural level interconnections | — | 2004-11-02 |
| 6787915 | Rearrangement sheet, semiconductor device and method of manufacturing thereof | Yoshihiro Saeki | 2004-09-07 |
| 6690089 | Semiconductor device having multi-chip package | — | 2004-02-10 |
| 6686223 | Method for fabricating multi-chip package semiconductor device | — | 2004-02-03 |
| 6620649 | Method for selectively providing adhesive on a semiconductor device | — | 2003-09-16 |
| 6614112 | Semiconductor device with shock absorbing bond pad | — | 2003-09-02 |
| 6576997 | Semiconductor device and method for fabricating the same | — | 2003-06-10 |
| 6569755 | Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same | Shigeru Yamada, Noriko Murakami, Yoshinori Shizuno | 2003-05-27 |
| 6459145 | Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor | Shigeru Yamada, Noriko Murakami, Yoshinori Shizuno | 2002-10-01 |
| 6437446 | Semiconductor device having first and second chips | — | 2002-08-20 |
| 6177725 | Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same | Shigeru Yamada, Noriko Murakami, Yoshinori Shizuno | 2001-01-23 |
| 6137166 | Semiconductor device | — | 2000-10-24 |
| 5864174 | Semiconductor device having a die pad structure for preventing cracks in a molding resin | Shigeru Yamada, Noriko Murakami, Yoshinori Shizuno | 1999-01-26 |