Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6569755 | Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same | Shigeru Yamada, Yasufumi Uchida, Yoshinori Shizuno | 2003-05-27 |
| 6459145 | Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor | Shigeru Yamada, Yasufumi Uchida, Yoshinori Shizuno | 2002-10-01 |
| 6177725 | Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same | Shigeru Yamada, Yasufumi Uchida, Yoshinori Shizuno | 2001-01-23 |
| 5864174 | Semiconductor device having a die pad structure for preventing cracks in a molding resin | Shigeru Yamada, Yasufumi Uchida, Yoshinori Shizuno | 1999-01-26 |