Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018055 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2011-09-13 |
| 7714434 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2010-05-11 |
| 7616167 | Semiconductor device and method of producing the same | — | 2009-11-10 |
| 7545036 | Semiconductor device that suppresses variations in high frequency characteristics of circuit elements | Makoto Terui | 2009-06-09 |
| 7538417 | Semiconductor device with signal line having decreased characteristic impedance | — | 2009-05-26 |
| 7511351 | Semiconductor device and method for fabricating the same | Makoto Terui | 2009-03-31 |
| 7459765 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2008-12-02 |
| 7239028 | Semiconductor device with signal line having decreased characteristic impedance | — | 2007-07-03 |
| 7173335 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2007-02-06 |
| 7026699 | Semiconductor device and method for fabricating the same | Makoto Terui | 2006-04-11 |
| 6982494 | Semiconductor device with signal line having decreased characteristic impedance | — | 2006-01-03 |
| 6833607 | Resin-molded semiconductor device that includes at least one additional electronic part | Makoto Terui | 2004-12-21 |
| 6806564 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2004-10-19 |
| 6707146 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2004-03-16 |
| 6608375 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2003-08-19 |
| 6541306 | Resin-sealed semiconductor device and method of manufacturing the device | Shinji Ohuchi | 2003-04-01 |
| 6323551 | Resin sealed-type semiconductor device and method of manufacturing the same | — | 2001-11-27 |
| 6274938 | Resin-sealed semiconductor device and method of manufacturing the device | Shinji Ohuchi | 2001-08-14 |
| 6259163 | Bond pad for stress releif between a substrate and an external substrate | Shinji Ohuchi, Yoshimi Egawa | 2001-07-10 |
| 6251704 | Method of manufacturing semiconductor devices having solder bumps with reduced cracks | Shinji Ohuchi, Yoshimi Egawa | 2001-06-26 |
| 6204563 | Semiconductor device | Shinji Ohuchi, Yoshimi Egawa | 2001-03-20 |
| 5999413 | Resin sealing type semiconductor device | Shinji Ohuchi | 1999-12-07 |