Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8486728 | Semiconductor device including semiconductor elements mounted on base plate | Shigeru Yamada, Yasushi Shiraishi | 2013-07-16 |
| 8008129 | Method of making semiconductor device packaged by sealing resin member | Shigeru Yamada, Yasushi Shiraishi | 2011-08-30 |
| 7977229 | Method for fabricating resin-molded semiconductor device having posts with bumps | Yasushi Shiraishi, Yasuo Tanaka | 2011-07-12 |
| 7928546 | Semiconductor device and manufacturing method thereof | Morifumi Ohno, Motoki Kobayashi, Makoto Terui, Mitsuhiko Ogihara | 2011-04-19 |
| 7723832 | Semiconductor device including semiconductor elements mounted on base plate | Shigeru Yamada, Yasushi Shiraishi | 2010-05-25 |
| 7704801 | Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device | Yasuo Tanaka | 2010-04-27 |
| 7592690 | Semiconductor device including semiconductor elements mounted on base plate | Shigeru Yamada, Yasushi Shiraishi | 2009-09-22 |
| 7427810 | Semiconductor device including semiconductor element mounted on another semiconductor element | Shigeru Yamada, Yasushi Shiraishi | 2008-09-23 |
| 7405138 | Manufacturing method of stack-type semiconductor device | Yasushi Shiraishi, Yasuo Tanaka | 2008-07-29 |
| 7314779 | Semiconductor device, manufacturing method for semiconductor device and mounting method for the same | Yasushi Shiraishi | 2008-01-01 |
| 7307337 | Resin-molded semiconductor device having posts with bumps and method for fabricating the same | Yasushi Shiraishi, Yasuo Tanaka | 2007-12-11 |
| 7019397 | Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device | Yasushi Shiraishi, Yasuo Tanaka | 2006-03-28 |
| 6911722 | Resin-molded semiconductor device having posts with bumps | Yasushi Shiraishi, Yasuo Tanaka | 2005-06-28 |
| 6852564 | Semiconductor device and method of fabricating the same | Harufumi Kobayashi, Yasushi Shiraishi | 2005-02-08 |
| 6750125 | Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby | — | 2004-06-15 |
| 6734092 | Semiconductor device and manufacturing method thereof | — | 2004-05-11 |
| 6699735 | Semiconductor device and method for manufacturing the semiconductor device | Yasuo Tanaka | 2004-03-02 |
| 6680535 | Semiconductor device, manufacturing method for semiconductor device and mounting method for the same | Yasushi Shiraishi | 2004-01-20 |
| 6673651 | Method of manufacturing semiconductor device including semiconductor elements mounted on base plate | Shigeru Yamada, Yasushi Shiraishi | 2004-01-06 |
| 6653218 | Method of fabricating resin-encapsulated semiconductor device | Harufumi Kobayashi, Yasushi Shiraishi | 2003-11-25 |
| 6613694 | Semiconductor device, manufacturing method for semiconductor device and mounting method for the same | Yasushi Shiraishi | 2003-09-02 |
| 6590257 | Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby | — | 2003-07-08 |
| 6573598 | Semiconductor device and method of fabricating the same | Harufumi Kobayashi, Yasushi Shiraishi | 2003-06-03 |
| 6562658 | Method of making semiconductor device having first and second sealing resins | Yasuo Tanaka | 2003-05-13 |
| 6541306 | Resin-sealed semiconductor device and method of manufacturing the device | Noritaka Anzai | 2003-04-01 |