Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495916 | Resin-encapsulated semiconductor device | Harufumi Kobayashi, Yasushi Shiraishi | 2002-12-17 |
| 6476501 | Semiconductor device, manufacturing method for semiconductor device and mounting method for the same | Yasushi Shiraishi | 2002-11-05 |
| 6403398 | Semiconductor device, manufacturing method thereof and aggregate type semiconductor device | Yasushi Shiraishi, Hiroshi Kawano, Etsuo Yamada | 2002-06-11 |
| 6353267 | Semiconductor device having first and second sealing resins | Yasuo Tanaka | 2002-03-05 |
| 6274938 | Resin-sealed semiconductor device and method of manufacturing the device | Noritaka Anzai | 2001-08-14 |
| 6271588 | Semiconductor device and manufacturing method thereof | — | 2001-08-07 |
| 6259163 | Bond pad for stress releif between a substrate and an external substrate | Yoshimi Egawa, Noritaka Anzai | 2001-07-10 |
| 6258621 | Method of fabricating a semiconductor device having insulating tape interposed between chip and chip support | Hiroshi Kawano, Etsuo Yamada, Yasushi Shiraishi | 2001-07-10 |
| 6251704 | Method of manufacturing semiconductor devices having solder bumps with reduced cracks | Yoshimi Egawa, Noritaka Anzai | 2001-06-26 |
| 6249043 | Resin-sealed type semiconductor device, and method of manufacturing the same | — | 2001-06-19 |
| 6229222 | Semiconductor device and method of fabricating the same | — | 2001-05-08 |
| 6208021 | Semiconductor device, manufacturing method thereof and aggregate type semiconductor device | Yasushi Shiraishi, Hiroshi Kawano, Etsuo Yamada | 2001-03-27 |
| 6204563 | Semiconductor device | Noritaka Anzai, Yoshimi Egawa | 2001-03-20 |
| 6201266 | Semiconductor device and method for manufacturing the same | Shigeru Yamada, Yasushi Shiraishi | 2001-03-13 |
| 6181003 | Semiconductor device packaged in plastic package | — | 2001-01-30 |
| 6130480 | Structure for packaging semiconductor chip | Yoshimi Egawa | 2000-10-10 |
| 6107164 | Using grooves as alignment marks when dicing an encapsulated semiconductor wafer | — | 2000-08-22 |
| 6097083 | Semiconductor device which is crack resistant | Etsuo Yamada, Yasushi Shiraishi | 2000-08-01 |
| 6084293 | Stacked semiconductor device | — | 2000-07-04 |
| 6002181 | Structure of resin molded type semiconductor device with embedded thermal dissipator | Etsuo Yamada, Yasushi Shiraishi, Hiroshi Kawano, Hidekazu Nasu | 1999-12-14 |
| 5998877 | Semiconductor device packaged in plastic and mold employable for production thereof | — | 1999-12-07 |
| 5999413 | Resin sealing type semiconductor device | Noritaka Anzai | 1999-12-07 |
| 5969410 | Semiconductor IC device having chip support element and electrodes on the same surface | Hiroshi Kawano, Etsuo Yamada, Yasushi Shiraishi | 1999-10-19 |
| 5877542 | Plastic molded type semiconductor device | — | 1999-03-02 |