Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236621 | Mold resin sealing device and molding method | — | 2012-08-07 |
| 7625768 | Transfer molding apparatus and method for manufacturing semiconductor device | Hiroyuki Nishi | 2009-12-01 |
| 7253021 | Transfer molding apparatus and method for manufacturing semiconductor devices | Hiroyuki Nishi | 2007-08-07 |
| 6995038 | Method of manufacturing semiconductor device | Yoshimi Egawa | 2006-02-07 |
| 6767484 | Transfer molding method for manufacturing semiconductor devices | Hiroyuki Nishi | 2004-07-27 |
| 6756690 | Molding die set and semiconductor device fabricated using the same | Shin Kurosawa | 2004-06-29 |
| 6491508 | Molding die set | Shin Kurosawa | 2002-12-10 |
| 6267577 | Transfer molding apparatus for manufacturing semiconductor devices | Hiroyuki Nishi | 2001-07-31 |