Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884466 | Semiconductor device with double-sided electrode structure and its manufacturing method | Masamichi Ishihara, Yoshihiko Ino | 2011-02-08 |
| 7571647 | Package structure for an acceleration sensor | Kengo Takemasa | 2009-08-11 |
| 7569917 | Semiconductor device | Masahiko Sugihara | 2009-08-04 |
| 7489043 | Semiconductor chip package and fabrication method thereof | Akira Tokumitsu, Hiroshi Kawano | 2009-02-10 |
| 7410829 | Method of fabricating a semiconductor chip package | Akira Tokumitsu | 2008-08-12 |
| 7304395 | Semiconductor chip package | Akira Tokumitsu | 2007-12-04 |
| 6975039 | Method of forming a ball grid array package | Kiyoshi Hasegawa | 2005-12-13 |
| 6677219 | Method of forming a ball grid array package | Kiyoshi Hasegawa | 2004-01-13 |
| 6300685 | Semiconductor package | Kiyoshi Hasegawa | 2001-10-09 |