Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7489043 | Semiconductor chip package and fabrication method thereof | Fumihiko Ooka, Hiroshi Kawano | 2009-02-10 |
| 7410829 | Method of fabricating a semiconductor chip package | Fumihiko Ooka | 2008-08-12 |
| 7304395 | Semiconductor chip package | Fumihiko Ooka | 2007-12-04 |
| 6887580 | Adhesive polyimide resin and adhesive laminate | Kiwamu Tokuhisa, Kazuaki Kaneko | 2005-05-03 |
| 5916688 | Resin solution compositions for electronic materials and protective membranes prepared therefrom for circuits in printed wiring boards | Kiwamu Tokuhisa, Isamu Takarabe | 1999-06-29 |
| 4937133 | Flexible base materials for printed circuits | Hisashi Watanabe, Seiji Satou, Kazuya Miyamoto, Haruhiko Aoi | 1990-06-26 |