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Semiconductor device and method of manufacturing the same |
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2012-12-18 |
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Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board |
Hiroshi Asami, Ken Orui, Fumito Hiwatashi |
2012-04-03 |
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Semiconductor device and method of manufacturing semiconductor device |
Tomoshi Ohde, Fujio Kanayama, Mitsuru Adachi, Tetsunori Niimi, Yuji Nishitani |
2011-02-01 |
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Semiconductor device having high cooling efficiency and method for manufacturing the same |
Kazuaki Yazawa |
2010-03-16 |
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Method of manufacturing multilayer wiring substrate using temporary metal support layer |
Hiroshi Asami, Yuki Nishitani, Ken Orui |
2008-09-09 |
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Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
Hiroshi Asami, Yuji Nishitani, Ken Orui |
2008-09-02 |
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Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
Hiroshi Asami, Yuji Nishitani, Ken Orui |
2007-10-30 |
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Method of manufacturing a high-frequency coil device |
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2007-05-15 |
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Manufacture method of a flexible multilayer wiring board |
Shinji Kumon |
2007-03-06 |
| 7115818 |
Flexible multilayer wiring board and manufacture method thereof |
Shinji Kumon |
2006-10-03 |
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High-frequency coil device and method of manufacturing the same |
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2005-09-06 |
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Electronic parts mounting board and production method thereof |
Sakan Iwashita, Haruhiko Makino |
2003-12-09 |
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Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device |
Kenji Oosawa, Tomoo Iijima |
2003-09-09 |
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Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus |
Kenji Ohsawa, Haruhiko Makino, Hideyuki Takahashi |
2003-05-13 |
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Lead frame and production method thereof, and semiconductor device and fabrication method thereof |
Kenji Ohsawa |
2002-10-15 |
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Semiconductor chip having an underplate metal layer |
Kenji Ohsawa |
2002-06-11 |
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Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device |
Kenji Oosawa, Tomoo Iijima |
2002-04-16 |
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Method of producing a semiconductor chip having an underplate metal layer |
Kenji Ohsawa |
2002-04-09 |
| 6351025 |
Semiconductor chip having an underplate metal layer |
Kenji Ohsawa |
2002-02-26 |
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Lead frame and production method thereof, and semiconductor device and fabrication method thereof |
Kenji Ohsawa |
2002-01-22 |
| 6140153 |
Lead frame, the manufacturing method, semiconductor device and the manufacturing method |
Kenji Ohsawa |
2000-10-31 |
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Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus |
Kenji Ohsawa, Haruhiko Makino, Hideyuki Takahashi |
2000-04-18 |