YN

Yuji Nishitani

SO Sony: 13 patents #3,381 of 25,231Top 15%
AC Alphana Technology Co.: 1 patents #13 of 30Top 45%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #385,551 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8599516 Disk drive device in which reduction in unbalanced amount can be adjusted 2013-12-03
8315011 Disk drive device improved in stiffness of fluid dynamic bearing 2012-11-20
7880317 Semiconductor device and method of manufacturing semiconductor device Tomoshi Ohde, Fujio Kanayama, Mitsuru Adachi, Tetsunori Niimi, Hidetoshi Kusano 2011-02-01
7436682 Wiring board, electronic component mounting structure, and electronic component mounting method Tomoshi Ohde 2008-10-14
7420127 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate Hiroshi Asami, Hidetoshi Kusano, Ken Orui 2008-09-02
7288724 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate Hiroshi Asami, Hidetoshi Kusano, Ken Orui 2007-10-30
7193311 Multi-chip circuit module and method for producing the same Tsuyoshi Ogawa 2007-03-20
7138294 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same Tsuyoshi Ogawa, Hiroshi Asami, Akihiko Okubora 2006-11-21
7053315 Junction structure and junction method for conductive projection Ken Orui, Hiroko Jinno, Hiroshi Asami 2006-05-30
6919226 Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structure Tsuyoshi Ogawa 2005-07-19
6831357 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same Tsuyoshi Ogawa, Hiroshi Asami, Akihiko Okubora 2004-12-14
6803324 Semiconductor device and its manufacturing method Tsuyoshi Ogawa, Akihiko Okubora 2004-10-12
6637105 Method of manufacturing a multilayer printed wiring board Yoshio Watanabe, Nobuyuki Yasuda, Hironori Mihono 2003-10-28