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Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board |
Hiroshi Asami, Hidetoshi Kusano, Fumito Hiwatashi |
2012-04-03 |
| 7421777 |
Method of manufacturing multilayer wiring substrate using temporary metal support layer |
Hiroshi Asami, Hidetoshi Kusano, Yuki Nishitani |
2008-09-09 |
| 7420127 |
Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
Hiroshi Asami, Hidetoshi Kusano, Yuji Nishitani |
2008-09-02 |
| 7288724 |
Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
Hiroshi Asami, Hidetoshi Kusano, Yuji Nishitani |
2007-10-30 |
| 7053315 |
Junction structure and junction method for conductive projection |
Hiroko Jinno, Yuji Nishitani, Hiroshi Asami |
2006-05-30 |