Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10270321 | Electric motor | Natsumi Tamura, Teppei Tokizaki, Satoshi Tamura | 2019-04-23 |
| 10128720 | Electric motor and electric pump | Masaki Ishizeki, Yoichi Shindo, Shinji Shibuya, Ken Hirota, Atsushi Takahashi +4 more | 2018-11-13 |
| 10104785 | Multilayer wiring board for an electronic device | Yoshitaka Fukuoka | 2018-10-16 |
| 9521755 | Multilayer wiring board for an electronic device | Yoshitaka Fukuoka | 2016-12-13 |
| 8736064 | Structure and method of making interconnect element having metal traces embedded in surface of dielectric | Hideki Kotake, Kiyoshi Hyodo, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino | 2014-05-27 |
| 8112881 | Method for manufacturing multilayer wiring board | Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai | 2012-02-14 |
| 7721422 | Methods of making microelectronic assemblies | Masayuki Ohsawa | 2010-05-25 |
| 7546681 | Manufacturing method for wiring circuit substrate | Masayuki Ohsawa | 2009-06-16 |
| 7505281 | Multilayer wiring board for an electronic device | Yoshitaka Fukuoka | 2009-03-17 |
| 7342802 | Multilayer wiring board for an electronic device | Yoshitaka Fukuoka | 2008-03-11 |
| 7238603 | Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate | Kimitaka Endo | 2007-07-03 |
| 7096578 | Manufacturing method for wiring circuit substrate | Masayuki Ohsawa | 2006-08-29 |
| 6884709 | Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate | Kimitaka Endo | 2005-04-26 |
| 6828221 | Manufacturing method for wiring circuit substrates | Masayuki Ohsawa | 2004-12-07 |
| 6782610 | Method for fabricating a wiring substrate by electroplating a wiring film on a metal base | Masayuki Oosawa, Shigeo Hirade | 2004-08-31 |
| 6646337 | Wiring circuit substrate and manufacturing method therefor | Masayuki Ohsawa | 2003-11-11 |
| 6617236 | Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device | Kenji Oosawa, Hidetoshi Kusano | 2003-09-09 |
| 6528874 | Wiring circuit substrate and manufacturing method thereof | Masayuki Ohsawa | 2003-03-04 |
| 6372620 | Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device | Kenji Oosawa, Hidetoshi Kusano | 2002-04-16 |
| 5613345 | Waste disposing system and apparatus | Yoshiko Saito, Teruyuki Fujita | 1997-03-25 |