TI

Tomoo Iijima

NO North: 8 patents #10 of 90Top 15%
TM Tessera Interconnect Materials: 7 patents #1 of 11Top 10%
IN Invensas: 3 patents #76 of 142Top 55%
SO Sony: 3 patents #10,744 of 25,231Top 45%
MI Mitsuba: 2 patents #181 of 618Top 30%
FC Fuji Machinery Co.: 1 patents #9 of 27Top 35%
Overall (All Time): #222,481 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10270321 Electric motor Natsumi Tamura, Teppei Tokizaki, Satoshi Tamura 2019-04-23
10128720 Electric motor and electric pump Masaki Ishizeki, Yoichi Shindo, Shinji Shibuya, Ken Hirota, Atsushi Takahashi +4 more 2018-11-13
10104785 Multilayer wiring board for an electronic device Yoshitaka Fukuoka 2018-10-16
9521755 Multilayer wiring board for an electronic device Yoshitaka Fukuoka 2016-12-13
8736064 Structure and method of making interconnect element having metal traces embedded in surface of dielectric Hideki Kotake, Kiyoshi Hyodo, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino 2014-05-27
8112881 Method for manufacturing multilayer wiring board Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai 2012-02-14
7721422 Methods of making microelectronic assemblies Masayuki Ohsawa 2010-05-25
7546681 Manufacturing method for wiring circuit substrate Masayuki Ohsawa 2009-06-16
7505281 Multilayer wiring board for an electronic device Yoshitaka Fukuoka 2009-03-17
7342802 Multilayer wiring board for an electronic device Yoshitaka Fukuoka 2008-03-11
7238603 Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate Kimitaka Endo 2007-07-03
7096578 Manufacturing method for wiring circuit substrate Masayuki Ohsawa 2006-08-29
6884709 Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate Kimitaka Endo 2005-04-26
6828221 Manufacturing method for wiring circuit substrates Masayuki Ohsawa 2004-12-07
6782610 Method for fabricating a wiring substrate by electroplating a wiring film on a metal base Masayuki Oosawa, Shigeo Hirade 2004-08-31
6646337 Wiring circuit substrate and manufacturing method therefor Masayuki Ohsawa 2003-11-11
6617236 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device Kenji Oosawa, Hidetoshi Kusano 2003-09-09
6528874 Wiring circuit substrate and manufacturing method thereof Masayuki Ohsawa 2003-03-04
6372620 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device Kenji Oosawa, Hidetoshi Kusano 2002-04-16
5613345 Waste disposing system and apparatus Yoshiko Saito, Teruyuki Fujita 1997-03-25