Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736064 | Structure and method of making interconnect element having metal traces embedded in surface of dielectric | Hideki Kotake, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino, Tomoo Iijima | 2014-05-27 |
| 6917848 | Production system for printed wiring board | Akitaka Nakayama, Akio Ikeda, Kazuo Uchida | 2005-07-12 |
| 6893576 | Method of manufacturing multi-layer printed wiring board | Akitaka Nakayama, Akio Ikeda, Kazuo Uchida | 2005-05-17 |