Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736064 | Structure and method of making interconnect element having metal traces embedded in surface of dielectric | Kiyoshi Hyodo, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino, Tomoo Iijima | 2014-05-27 |