Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10104785 | Multilayer wiring board for an electronic device | Tomoo Iijima | 2018-10-16 |
| 9521755 | Multilayer wiring board for an electronic device | Tomoo Iijima | 2016-12-13 |
| 8198541 | Electronic component built-in wiring board and method for radiating heat generated at the same | Kenji Sasaoka | 2012-06-12 |
| 8114714 | Electronic device and production method thereof | Satoru Kuramochi | 2012-02-14 |
| 7772684 | Electronic device and production method thereof | Satoru Kuramochi | 2010-08-10 |
| 7679925 | Method for fabricating wiring board provided with passive element, and wiring board provided with passive element | Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi | 2010-03-16 |
| 7644497 | Component built-in wiring board and manufacturing method of component built-in wiring board | Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Hiroyuki Hirai +3 more | 2010-01-12 |
| 7505281 | Multilayer wiring board for an electronic device | Tomoo Iijima | 2009-03-17 |
| 7345888 | Component built-in wiring board and manufacturing method of component built-in wiring board | Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Hiroyuki Hirai +3 more | 2008-03-18 |
| 7342802 | Multilayer wiring board for an electronic device | Tomoo Iijima | 2008-03-11 |
| 7242591 | Wiring board incorporating components and process for producing the same | Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Hiroyuki Hirai +3 more | 2007-07-10 |
| 7100276 | Method for fabricating wiring board provided with passive element | Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi | 2006-09-05 |
| 6872893 | Wiring board provided with passive element and cone shaped bumps | Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi | 2005-03-29 |
| 6705003 | Printed wiring board with plurality of interconnect patterns and conductor bumps | Tomohisa Motomura | 2004-03-16 |
| 6388321 | Anisotropic conductive film and resin filling gap between a flip-chip and circuit board | Hiroyuki Hirai | 2002-05-14 |
| 6353189 | Wiring board, wiring board fabrication method, and semiconductor package | Osamu Shimada, Akihiko Takagi, Kenji Sasaoka | 2002-03-05 |
| 6237218 | Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board | Akira Ogawa | 2001-05-29 |
| 5949654 | Multi-chip module, an electronic device, and production method thereof | — | 1999-09-07 |
| 5915753 | Method of producing a high-density printed wiring board for mounting | Tomohisa Motomura, Osamu Shimada | 1999-06-29 |
| 5818699 | Multi-chip module and production method thereof | — | 1998-10-06 |
| 5737833 | Method of producing a high-density printed wiring board for mounting | Tomohisa Motomura, Osamu Shimada | 1998-04-14 |
| 5532906 | Wiring substrate | Jun Hanari, Takeshi Miyagi, Kazuhiro Matsumoto, Ayako Tohdake | 1996-07-02 |
| 5169493 | Method of manufacturing a thick film resistor element | Minoru Nii | 1992-12-08 |
| 5153709 | Electronic apparatus | — | 1992-10-06 |
| 4639830 | Packaged electronic device | — | 1987-01-27 |