Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8987901 | Component built-in wiring board and manufacturing method of component built-in wiring board | — | 2015-03-24 |
| 8737085 | Wiring board with a built-in component and method for manufacturing the same | — | 2014-05-27 |
| 8350388 | Component built-in wiring board and manufacturing method of component built-in wiring board | — | 2013-01-08 |
| 8198541 | Electronic component built-in wiring board and method for radiating heat generated at the same | Yoshitaka Fukuoka | 2012-06-12 |
| 7644497 | Component built-in wiring board and manufacturing method of component built-in wiring board | Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka +3 more | 2010-01-12 |
| 7526859 | Apparatus for manufacturing a wiring board | Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama | 2009-05-05 |
| 7345888 | Component built-in wiring board and manufacturing method of component built-in wiring board | Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka +3 more | 2008-03-18 |
| 7242591 | Wiring board incorporating components and process for producing the same | Tatsuro Imamura, Yuji Yamaguchi, Kazuhiro Shinozaki, Satoshi Shibazaki, Yoshitaka Fukuoka +3 more | 2007-07-10 |
| 7134193 | Method for manufacturing a wiring board | Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama | 2006-11-14 |
| 6865801 | Apparatus for manufacturing a wiring board | Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama | 2005-03-15 |
| 6534873 | Semiconductor package and printed wiring board for semiconductor package | Yoshizumi Sato | 2003-03-18 |
| 6507995 | Apparatus for manufacturing a wiring substrate | Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Yoshizumi Sato, Koichiro Shibayama | 2003-01-21 |
| 6353189 | Wiring board, wiring board fabrication method, and semiconductor package | Osamu Shimada, Yoshitaka Fukuoka, Akihiko Takagi | 2002-03-05 |
| 6010769 | Multilayer wiring board and method for forming the same | Hiroshi Odaira, Madoka Fujiwara, Fumitoshi Ikegaya, Takahiro Mori | 2000-01-04 |
| 5822850 | Circuit devices and fabrication Method of the same | Hiroshi Odaira, Eiji IMAMURA, Yusuke Wada, Yasushi Arai, Takahiro Mori +2 more | 1998-10-20 |
| 5600103 | Circuit devices and fabrication method of the same | Hiroshi Odaira, Eiji IMAMURA, Yusuke Wada, Yasushi Arai, Takahiro Mori +2 more | 1997-02-04 |