Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7526859 | Apparatus for manufacturing a wiring board | Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Koichiro Shibayama | 2009-05-05 |
| 7134193 | Method for manufacturing a wiring board | Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Koichiro Shibayama | 2006-11-14 |
| 6865801 | Apparatus for manufacturing a wiring board | Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Koichiro Shibayama | 2005-03-15 |
| 6534873 | Semiconductor package and printed wiring board for semiconductor package | Kenji Sasaoka | 2003-03-18 |
| 6507995 | Apparatus for manufacturing a wiring substrate | Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Koichiro Shibayama | 2003-01-21 |
| 6329610 | Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board | Chiaki Takubo, Tomitsugu Kojima, Go TAKEDA | 2001-12-11 |
| 5865934 | Method of manufacturing printed wiring boards | Yuichi Yamamoto, Tomohisa Motomura, Hiroshi Hamano, Yasushi Arai | 1999-02-02 |
| 5736681 | Printed wiring board having an interconnection penetrating an insulating layer | Yuichi Yamamoto, Tomohisa Motomura, Hiroshi Hamano, Yasushi Arai | 1998-04-07 |
| 5407557 | Wiring boards and manufacturing methods thereof | Atsuko Iida, Hiroshi Odaira, Yuichi Yamamoto | 1995-04-18 |
| 5333379 | Method of producing a three-dimensional wiring board | Hiroshi Odaira | 1994-08-02 |
| 5310966 | Wiring boards and manufacturing methods thereof | Atsuko Iida, Hiroshi Odaira, Yuichi Yamamoto | 1994-05-10 |