Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8633392 | Circuit board with high-density circuit patterns | Shuhichi Okabe, Myung Sam Kang, Jung-Hyun Park, Jeong Woo Park, Ji Eun Kim | 2014-01-21 |
| 8418355 | Method for manufacturing circuit board | Sang-Duck Kim, Jung-Hyun Park, Jong-Gyu Choi, Ji Eun Kim, Jeong Woo Park | 2013-04-16 |
| 8124880 | Circuit board and method for manufacturing thereof | Shuhichi Okabe, Myung Sam Kang, Jung-Hyun Park, Jeong Woo Park, Ji Eun Kim | 2012-02-28 |
| 8003439 | Board on chip package and manufacturing method thereof | Myung Sam Kang, Chang-Sup Ryu, Jung-Hyun Park, Ji Eun Kim | 2011-08-23 |
| 7992291 | Method of manufacturing a circuit board | Je-Gwang Yoo, Myung Sam Kang, Ji Eun Kim, Jeong Woo Park, Jung-Hyun Park | 2011-08-09 |
| 7937833 | Method of manufacturing circuit board | Je-Gwang Yoo, Myung Sam Kang, Ji Eun Kim, Jeong Woo Park, Jung-Hyun Park | 2011-05-10 |
| 7858437 | Method for manufacturing a substrate with cavity | Myung Sam Kang, Ji Eun Kim, Jung-Hyun Park | 2010-12-28 |
| 7802358 | Rigid-flexible printed circuit board manufacturing method for package on package | Myung Sam Kang, Jung-Hyun Park | 2010-09-28 |
| 7562446 | Method for manufacturing substrate with cavity | Myung Sam Kang, Jung-Hyun Park | 2009-07-21 |
| 7550316 | Board on chip package and manufacturing method thereof | Myung Sam Kang, Chang-Sup Ryu, Jung-Hyun Park, Ji Eun Kim | 2009-06-23 |
| 7516545 | Method of manufacturing printed circuit board having landless via hole | Myung Sam Kang, Shuhichi Okabe, Jung-Hyun Park, Ji Eun Kim | 2009-04-14 |
| 7498205 | Method for manufacturing substrate with cavity | Myung Sam Kang, Jung-Hyun Park | 2009-03-03 |
| 7494844 | Method for manufacturing substrate with cavity | Myung Sam Kang, Jung-Hyun Park | 2009-02-24 |