Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8986555 | Method of manufacturing printed circuit board having bump | Ji Eun Kim, Nam Keun Oh, Jung-Hyun Park, Young Ji KIM, Sang-Duck Kim | 2015-03-24 |
| 8945993 | Method of manufacturing a ball grid array substrate or a semiconductor chip package | Jung-Hyun Park, Nam Keun Oh, Sang-Duck Kim, Young Ji KIM, Ji Eun Kim +1 more | 2015-02-03 |
| 8889994 | Single-layered printed circuit board and manufacturing method thereof | Young Ji KIM, Kyung-Ro Yoon, Sang-Duck Kim, Jung-Hyun Park, Nam Keun Oh +1 more | 2014-11-18 |
| 8546943 | Ball grid array substrate with insulating layer and semiconductor chip package | Jung-Hyun Park, Nam Keun Oh, Sang-Duck Kim, Young Ji KIM, Ji Eun Kim +1 more | 2013-10-01 |
| 8418355 | Method for manufacturing circuit board | Sang-Duck Kim, Jung-Hyun Park, Hoe-Ku Jung, Ji Eun Kim, Jeong Woo Park | 2013-04-16 |