Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553452 | Printed circuit board, method, and semiconductor package | Suk Chang Hong, Dong Kwang Shin, Sang-Jin Baek | 2020-02-04 |
| 9040838 | Method for forming solder resist and substrate for package | Chang Bo LEE, Chang-Sup Ryu, Cheol Ho Choi | 2015-05-26 |
| 8206530 | Manufacturing method of printed circuit board having electro component | Doo Hwan Lee, Kyung Min Lee | 2012-06-26 |