Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9021693 | Method of manufacturing printed circuit board with metal bump | Jae Joon Lee | 2015-05-05 |
| 8677618 | Method of manufacturing substrate using a carrier | Ki Hwan Kim, Myung Sam Kang | 2014-03-25 |
| 8499444 | Method of manufacturing a package substrate | Chang-Sup Ryu, Jong-Kuk Hong | 2013-08-06 |
| 8209860 | Method of manufacturing printed circuit board having metal bump | Seok-Kyu Lee | 2012-07-03 |
| 8207450 | Printed circuit board comprising metal bumps integrated with connection pads | Jae Joon Lee | 2012-06-26 |
| 8051559 | Method of manufacturing a multi-layer board | Ki Hwan Kim, Jong-Kuk Hong | 2011-11-08 |
| 7971352 | Method of manufacturing printed circuit board | Shuhichi Okabe, Seok-Kyu Lee, Soon-Oh Jung, Jong-Kuk Hong, Hae-Nam Seo | 2011-07-05 |
| 7707715 | Method of fabricating multilayer printed circuit board | Shuhichi Okabe, Je-Gwang Yoo, Chang-Sup Ryu, Myung Sam Kang, Jung-Hyun Park +2 more | 2010-05-04 |
| 7499258 | Embedded multilayer chip capacitor and printed circuit board having the same | Chang Hoon Shim, Suk Hyeon Cho, Sung Hyung Kang | 2009-03-03 |
| 5345293 | Feeder of continuous documents for a copy machine | In-Kuk Baek, Jae-Joon Kim | 1994-09-06 |