Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7021521 | Bump connection and method and apparatus for forming said connection | Hiroyuki Sakurai | 2006-04-04 |
| 6455785 | Bump connection with stacked metal balls | Hiroyuki Sakurai | 2002-09-24 |
| 6184479 | Multilayer printed circuit board having a concave metal portion | Shuhichi Okabe | 2001-02-06 |
| 6105243 | Method of fabricating multilayer printed circuit board | Shuhichi Okabe | 2000-08-22 |
| 5060843 | Process of forming bump on electrode of semiconductor chip and apparatus used therefor | Tadao Yasuzato | 1991-10-29 |