Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8809122 | Method of manufacturing flip chip package | Young-Hwan Shin, Soon Jin Cho, Jong-Yong Kim, Jin Seok Lee | 2014-08-19 |
| 8558360 | Flip chip package and method of manufacturing the same | Young-Hwan Shin, Soon Jin Cho, Jong-Yong Kim, Jin Seok Lee | 2013-10-15 |