Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11426678 | Sublimation purification apparatus and sublimation purification method | Seok Kwang Hong, Hyoung Seok Kim, Hun Young Lee, Kwang-Jin Jeong | 2022-08-30 |
| D952213 | Rear combination lamp for an automobile | Roberto Kuehn | 2022-05-17 |
| D952210 | Head lamp for an automobile | Roberto Kuehn | 2022-05-17 |
| D952212 | Rear combination lamp for an automobile | — | 2022-05-17 |
| D951503 | Head lamp for an automobile | Roberto Kuehn | 2022-05-10 |
| D950816 | Rear combination lamp for an automobile | Roberto Kuehn | 2022-05-03 |
| D950817 | Rear combination lamp for an automobile | Roberto Kuehn | 2022-05-03 |
| 9526169 | Printed circuit board and method for manufacturing the same | Hyung Gi Ha, Jae Won Jung, Yong Hwan KIM, Jong Jin Lee, Ja Ho Koo +1 more | 2016-12-20 |
| 9161460 | Printed circuit board and method for manufacturing the same | Hyung Gi Ha, Jae Won Jung, Yong Hwan KIM, Jong Jin Lee, Ja Ho Koo +1 more | 2015-10-13 |
| 8809122 | Method of manufacturing flip chip package | Ey Yong Kim, Soon Jin Cho, Jong-Yong Kim, Jin Seok Lee | 2014-08-19 |
| 8558360 | Flip chip package and method of manufacturing the same | Ey Yong Kim, Soon Jin Cho, Jong-Yong Kim, Jin Seok Lee | 2013-10-15 |
| 8399801 | Method of manufacturing printed circuit board | Hwa Sub Oh, Jung-Woo Cho, Sung Jin LIM | 2013-03-19 |
| 8253034 | Printed circuit board and semiconductor package with the same | Byoung Chan Kim, Chin-Kwan Kim, Dong Won Kim, Kui Won Kang | 2012-08-28 |
| 8236690 | Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad | Kyoung Ro Yoon, Yoon Su Kim, Tae-Gon Lee | 2012-08-07 |
| 8201324 | Method of manufacturing electronic component embedded circuit board | Byoung Chan Kim, Jong Jin Lee | 2012-06-19 |
| 8144972 | Manufacturing method of printed circuit board and manufacturing apparatus for the same | Chung-Woo Cho, Seon Ha Kang, Jong Jin Lee | 2012-03-27 |
| 8106308 | Printed circuit board for package and manufacturing method thereof | Hyung Jin Jeon, Tae-Gon Lee | 2012-01-31 |
| 8084696 | Printed circuit board and manufacturing method thereof | Tae-Gui Kim, Jae Soo Lee, Tae-Gon Lee | 2011-12-27 |
| 7807215 | Method of manufacturing copper-clad laminate for VOP application | Jong Jin Lee, Jae Min Choi, Chang Yul Oh | 2010-10-05 |
| 7802361 | Method for manufacturing the BGA package board | Kyoung Ro Yoon, Tae-Gon Lee | 2010-09-28 |
| 7795719 | Electro component package | Heung-Kyu Kim, Jong Jin Lee | 2010-09-14 |
| 7768116 | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same | Kyoung Ro Yoon, Yoon Su Kim, Tae-Gon Lee | 2010-08-03 |
| 7629692 | Via hole having fine hole land and method for forming the same | Chong-Ho Kim, Jong Min Choi | 2009-12-08 |
| 7408261 | BGA package board and method for manufacturing the same | Kyoung Ro Yoon, Tae-Gon Lee | 2008-08-05 |
| 7387917 | BGA package substrate and method of fabricating same | Jae Min Choi | 2008-06-17 |