Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495546 | Substrate having electronic component embedded therein | Je Sang Park, Sang Ho Jeong, Yong-duk Lee | 2022-11-08 |
| 11244905 | Substrate with electronic component embedded therein | Je Sang Park, Sang Ho Jeong, Yong-duk Lee | 2022-02-08 |
| 10863627 | Electronic component embedded substrate | Je Sang Park, Sang Ho Jeong | 2020-12-08 |
| 8517249 | Soldering structure and method using Zn | Won Kyoung Choi, Chang-youl Moon, Yoon Chul SON, Young-Ho Kim, Hee Ra Roh | 2013-08-27 |
| 7807215 | Method of manufacturing copper-clad laminate for VOP application | Jong Jin Lee, Young-Hwan Shin, Jae Min Choi | 2010-10-05 |