| 10650977 |
Ceramic electronic component and method of manufacturing the same and electronic device |
Minoru Osada, Takayoshi Sasaki, Chan Kwak, Doh Won JUNG, Youngjin Cho |
2020-05-12 |
|
| 10643791 |
Dielectric material, multi-layered capacitors and electronic devices comprising the same |
Hyun Sik Kim, Kyoung-Seok Moon, Daejin YANG, Chan Kwak |
2020-05-05 |
|
| 10475583 |
Dielectric composites, and multi-layered capacitors and electronic devices comprising thereof |
Chan Kwak, Hyun Sik Kim, Jong Wook Roh, Kyoung-Seok Moon, Hyeon Cheol PARK +3 more |
2019-11-12 |
|
| 10395790 |
Transparent conductor and electronic device including the same |
Doh Won JUNG, Hee-jung PARK, Kimoon Lee, Woojin Lee, Youngjin Cho |
2019-08-27 |
|
| 10266407 |
Electrically conductive thin films |
Se Yun Kim, Sang-Il Kim, Sung Woo Hwang, Yong-Hee Cho, Jae Young Choi |
2019-04-23 |
|
| 10138125 |
Electrically conductive thin films |
Sang-Il Kim, Se Yun Kim, Kyoung-Seok Moon, Sung Woo Hwang, Hyosug LEE |
2018-11-27 |
|
| 10099938 |
Electrically conductive thin films |
Byungki RYU, Sang-mock Lee |
2018-10-16 |
|
| 9899209 |
Electrically conductive thin films |
Doh Won JUNG, Hee-jung PARK, Yun-sung Woo, Jongmin Lee, Yong-Hee Cho +3 more |
2018-02-20 |
|
| 9837179 |
Electrically conductive thin films |
Kimoon Lee, Sang-Il Kim, Se Yun Kim, Sung Woo Hwang, Woojin Lee +5 more |
2017-12-05 |
|
| 9809455 |
Conductive material and electrical device including the same |
Sung Woo Hwang, Kyoung-Seok Moon, Youngjin Cho, Kimoon Lee, Doh Won JUNG |
2017-11-07 |
|
| 9809460 |
Electrically conductive thin films containing Re2C |
Hee-jung PARK, Doh Won JUNG, Woojin Lee, Jae Young Choi |
2017-11-07 |
|
| 9666324 |
Transparent conductive thin film |
Hyeon Cheol PARK, Kwang Hee KIM, Chan Kwak, Sang-mock Lee |
2017-05-30 |
|
| 9648738 |
Electrical conductors, production methods thereof, and electronic devices including the same |
Doh Won JUNG, Woojin Lee, Jongmin Lee |
2017-05-09 |
|
| 9546415 |
Composite transparent electrodes |
Hyeon Cheol PARK, Kwang Hee KIM, Chan Kwak, Sang-mock Lee |
2017-01-17 |
|
| 9508987 |
Composite anode active material, method of preparing the composite anode active material, and lithium battery including the composite anode active material |
Ho-suk Kang, Jeong Hee Lee, Jeong-na Heo |
2016-11-29 |
|
| 9501013 |
Heating member and fusing apparatus including the same |
Sang-eui LEE, Dong-earn KIM, Dong-ouk KIM, Ha-Jin Kim, Sung Hoon Park +3 more |
2016-11-22 |
|
| 9440853 |
Hafnium telluride layered compounds, transparent and electrically conductive film, and electronic devices including the same |
Kimoon Lee, Byungki RYU, Hyeon Cheol PARK, Sang-mock Lee |
2016-09-13 |
|
| 9348280 |
Heating composite, and heating apparatus and fusing apparatus including the same |
Sang-eui LEE, In-Taek Han, Ha-Jin Kim, Dong-ouk KIM, Dong-earn KIM +1 more |
2016-05-24 |
|
| 9272902 |
Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same |
Dong-ouk KIM, Dong-earn KIM, Ha-Jin Kim, Sung Hoon Park, Min-jong Bae +3 more |
2016-03-01 |
|
| 9165701 |
Resistance heating element and heating member and fusing device employing the same |
Kun-mo CHU, Dong-earn KIM, Sang-eui LEE, Dong-ouk KIM, Ha-Jin Kim +2 more |
2015-10-20 |
|
| 9052655 |
Heating member including a base polymer and fusing apparatus including the same |
Dong-earn KIM, Dong-ouk KIM, Ha-Jin Kim, Sung Hoon Park, Min-jong Bae +3 more |
2015-06-09 |
|
| 9037063 |
Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member |
Sang-eui LEE, Ha-Jin Kim, Dong-earn KIM, Dong-ouk KIM, Sung Hoon Park +2 more |
2015-05-19 |
|
| 9002253 |
Heating member and fusing device including the same |
Dong-earn KIM, Dong-ouk KIM, Ha-Jin Kim, Sung Hoon Park, Min-jong Bae +2 more |
2015-04-07 |
|
| 8691685 |
Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present |
Sung Kwon Kang, Da-Yuan Shih |
2014-04-08 |
$7,562,000 |
| 8679964 |
Prevention and control of intermetallic alloy inclusions |
Sung Kwon Kang, Da-Yuan Shih |
2014-03-25 |
$4,381,000 |
