Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12023732 | Iron-based mixed powder and method for manufacturing the same | Wang Yong, Choong Kwon Park | 2024-07-02 |
| 11935682 | Coil component and manufacturing method for the same | Seon Woo Oh, Soon Kwang Kwon | 2024-03-19 |
| 11820587 | Hopper for raw material powder and method for transferring raw material powder by using same | Wang Yong, Ji Min Yu | 2023-11-21 |
| 11763970 | Coil electronic component | Soon Kwang Kwon, Seon Woo Oh | 2023-09-19 |
| 11538620 | Coil electronic component | Soon Kwang Kwon | 2022-12-27 |
| 11342110 | Inductor | Seon Woo Oh, Jung Wook Seo, Young Seuck Yoo, Byoung Hwa Lee, Kwang Sun CHOI +1 more | 2022-05-24 |
| 9966179 | Common mode filter for improving magnetic permeability and high frequency characteristics | Chin Mo Kim, Jung Wook Seo, Eun Hye Na, Hak Kwan Kim, Sung Yong An | 2018-05-08 |
| 9928953 | Coil component and method of manufacturing the same | Jung Wook Seo, Eun Hye Na | 2018-03-27 |
| 9609183 | Camera module and electronic device including the same | Kang Ryong CHOI, Jeong Gu Yeo, Kang Heon Hur, Sung Yong An, Jung Wook Seo | 2017-03-28 |
| 9257615 | Light emitting device package and method of manufacturing the same | Young Ki Lee, Seog Moon Choi, Sang Hyun Shin | 2016-02-09 |
| 9196506 | Method for manufacturing interposer | Jong In Ryu, Seung Wan Shin, Seon Hee Moon, Young Do Kweon, Seung Wook Park | 2015-11-24 |
| 9173291 | Circuit board and method for manufacturing the same | Sung-Wook Han, Young Do Kweon, Jin Gu Kim, Yoon Su Kim | 2015-10-27 |
| 8756804 | Method of manufacturing printed circuit board | Young Do Kweon, Seung Wook Park, Seon Hee Moon | 2014-06-24 |
| 8704350 | Stacked wafer level package and method of manufacturing the same | Seung Wook Park, Young Do Kweon, Jin Gu Kim, Ju Pyo Hong, Hee Kon Lee +2 more | 2014-04-22 |
| 8658467 | Method of manufacturing stacked wafer level package | Seung Wook Park, Young Do Kweon, Jin Gu Kim, Ju Pyo Hong, Hee Kon Lee +2 more | 2014-02-25 |
| 8299692 | Light emitting device package and method of manufacturing the same | Young Ki Lee, Seog Moon Choi, Sang Hyun Shin | 2012-10-30 |
| 8143099 | Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer | Seung Wook Park, Jin Gu Kim, Jong Hwan Baek, Jong Yun Lee, Young Do Kweon | 2012-03-27 |
| 8106308 | Printed circuit board for package and manufacturing method thereof | Young-Hwan Shin, Tae-Gon Lee | 2012-01-31 |
| 7960806 | Sub-mount, light emitting diode package and manufacturing method thereof | Young Ki Lee, Seog Moon Choi, Sang Hyun Shin | 2011-06-14 |
| 7947530 | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | Jin Gu Kim, Young Do Kweon, Seung Wook Park, Hee Kon Lee, Seon Hee Moon | 2011-05-24 |
| 7663250 | Wafer level package and manufacturing method thereof | Sung Yi, Jong Yun Lee, Young Do Kweon, Jong Hwan Baek | 2010-02-16 |
| 7632709 | Method of manufacturing wafer level package | Sung Yi, Young Do Kweon, Jong Yun Lee, Joon Seok Kang, Seung Wook Park | 2009-12-15 |
| 7315492 | Header mask signal generating track jump method for a recording medium | Seong Pyo Hong, Sang On Park | 2008-01-01 |
| 7012861 | Track jump method for a recording medium | Seong Pyo Hong, Sang On Park | 2006-03-14 |
| 6747932 | Apparatus and method for detecting non-recording regions of an optical recording medium | — | 2004-06-08 |