Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685916 | Fan-out semiconductor package | Ho Jun Jung, Seung Chul Oh | 2020-06-16 |
| 10347585 | Fan-out semiconductor package | Seung Chul Oh | 2019-07-09 |
| 9196506 | Method for manufacturing interposer | Hyung Jin Jeon, Jong In Ryu, Seon Hee Moon, Young Do Kweon, Seung Wook Park | 2015-11-24 |
| 8582314 | Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure | Seung Wook Park, Young Do Kweon, Mi Jin Park, Kyung Seob Oh | 2013-11-12 |