Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236690 | Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad | Kyoung Ro Yoon, Young-Hwan Shin, Yoon Su Kim | 2012-08-07 |
| 8106308 | Printed circuit board for package and manufacturing method thereof | Hyung Jin Jeon, Young-Hwan Shin | 2012-01-31 |
| 8084696 | Printed circuit board and manufacturing method thereof | Tae-Gui Kim, Young-Hwan Shin, Jae Soo Lee | 2011-12-27 |
| 7802361 | Method for manufacturing the BGA package board | Kyoung Ro Yoon, Young-Hwan Shin | 2010-09-28 |
| 7768116 | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same | Kyoung Ro Yoon, Young-Hwan Shin, Yoon Su Kim | 2010-08-03 |
| 7414317 | BGA package with concave shaped bonding pads | Hyo Soo Lee, Sung-Eun Park | 2008-08-19 |
| 7408261 | BGA package board and method for manufacturing the same | Kyoung Ro Yoon, Young-Hwan Shin | 2008-08-05 |