Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10190971 | Analyzing color of color alloy using reflectance | Hyouk Chon Kwon, Hai Joong LEE, Heong Won Shin | 2019-01-29 |
| 7829985 | BGA package having half-etched bonding pad and cut plating line and method of fabricating same | Sung-Eun Park | 2010-11-09 |
| 7414317 | BGA package with concave shaped bonding pads | Tae-Gon Lee, Sung-Eun Park | 2008-08-19 |
| 7346982 | Method of fabricating printed circuit board having thin core layer | Chong-Ho Kim, Dong-Kuk Kim, Young-Hwan Shin | 2008-03-25 |
| 7298887 | System for and method of analyzing surface condition of PCB using RGB colors | Young-Hwan Shin, Chong-Ho Kim | 2007-11-20 |
| 6491862 | Method for producing SiC preform with high volume fraction | Soon Hyung Hong, Kyung Yoon Jeon | 2002-12-10 |
| 6190604 | Process for preparing a preform with high volume fraction SiC | Soon Hyung Hong, Kyung Yoon Jeon | 2001-02-20 |