Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8830689 | Interposer-embedded printed circuit board | Jin Gu Kim, Mi Jin Park, Young-Ho Kim, Seung Wook Park, Young Do Kweon | 2014-09-09 |
| 8704350 | Stacked wafer level package and method of manufacturing the same | Seung Wook Park, Young Do Kweon, Jin Gu Kim, Ju Pyo Hong, Hyung Jin Jeon +2 more | 2014-04-22 |
| 8658467 | Method of manufacturing stacked wafer level package | Seung Wook Park, Young Do Kweon, Jin Gu Kim, Ju Pyo Hong, Hyung Jin Jeon +2 more | 2014-02-25 |
| 7947530 | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | Jin Gu Kim, Young Do Kweon, Hyung Jin Jeon, Seung Wook Park, Seon Hee Moon | 2011-05-24 |