Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8674781 | Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer | — | 2014-03-18 |
| 8607448 | Method of manufacturing a printed circuit board having micro strip line | — | 2013-12-17 |
| 8294529 | Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer | — | 2012-10-23 |
| 7795719 | Electro component package | Young-Hwan Shin, Jong Jin Lee | 2010-09-14 |