Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7346982 | Method of fabricating printed circuit board having thin core layer | Chong-Ho Kim, Dong-Kuk Kim, Hyo Soo Lee | 2008-03-25 |
| 7298887 | System for and method of analyzing surface condition of PCB using RGB colors | Hyo Soo Lee, Chong-Ho Kim | 2007-11-20 |
| 7256495 | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same | Jong Jin Lee | 2007-08-14 |
| 7208349 | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same | Jong Jin Lee | 2007-04-24 |
| 7030500 | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same | Chong-Ho Kim, Tae-Gui Kim | 2006-04-18 |
| 6852625 | Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same | Chong-Ho Kim, Tae-Gui Kim | 2005-02-08 |
| 6405431 | Method for manufacturing build-up multi-layer printed circuit board by using yag laser | Dong Kwang Shin, Keon-Yang Park, Byung-Kook Sun, Jae Heun Joung | 2002-06-18 |
| 5837427 | Method for manufacturing build-up multi-layer printed circuit board | Se Meyung Hwang, Keon-Yang Park | 1998-11-17 |