Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5837427 | Method for manufacturing build-up multi-layer printed circuit board | Keon-Yang Park, Young-Hwan Shin | 1998-11-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5837427 | Method for manufacturing build-up multi-layer printed circuit board | Keon-Yang Park, Young-Hwan Shin | 1998-11-17 |