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Seon Jae Mun — 12 Patents

Samsung: 12 patents #11,368 of 75,807Top 15%
Seojong-myeon, KR: #904 of 10,205 inventorsTop 9%
Overall (All Time): #396,045 of 4,157,543Top 10%
12 Patents All Time
Seon Jae Mun has been granted 12 US patents while listed as an inventor at Samsung. The first was granted in 2013 and the most recent in July 2024. Seon Jae Mun ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Seon Jae Mun in Seojong-myeon, KR.

Patents per Year

Patents granted per year, 2013 to 2024Bar chart with a peak of 6 patents in 2024.peak 62013: 2 patents20132014: 2 patents20142020: 1 patents20202021: 1 patents20212024: 6 patents2024

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12051543 Mutilayer electronic component and method of manufacturing the same Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha, Jong Ho Lee 2024-07-30
12002623 Multilayered electronic component Tae Gyeom Lee, Gi Long Kim, Byung Rok Ahn, Kyoung Jin Cha 2024-06-04
12002627 Multilayer electronic component and method of manufacturing the same Tae Gyeom Lee, Gi Long Kim, Byung Rok Ahn, Kyoung Jin Cha 2024-06-04
12002628 Multilayered electronic component and method of manufacturing the same Tae Gyeom Lee, Gi Long Kim, Byung Rok Ahn, Kyoung Jin Cha 2024-06-04
11996244 Multilayer electronic component and method of manufacturing the same Gi Long Kim, Kyoung Jin Cha, Tae Gyeom Lee, Byung Rok Ahn, Jong Ho Lee 2024-05-28
11990284 Multilayered electronic component Jong Ho Lee, Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha 2024-05-21
11049659 Multilayer ceramic electronic component and method for manufacturing the same Kyoung Jin Cha, Seung Heui Lee, Beom Seock Oh, Kwang Sic Kim, Dong Hoon Kim +1 more 2021-06-29
10770227 Capacitor and board having the same Jae Yeol Choi, Seung Heui Lee, Jong Ho Lee, Kyoung Jin Cha 2020-09-08
8835302 Method of fabricating a package substrate Dong Gyu Lee, Dae-Young Lee, Tae Joon Chung, Jin Won Choi 2014-09-16
8671564 Substrate for flip chip bonding and method of fabricating the same Hueng Jae Oh, Tae Joon Chung, Dong Gyu Lee, Jin Won Choi 2014-03-18
8486760 Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Hueng Jae Oh 2013-07-16
8456003 Package substrate capable of controlling the degree of warpage Dong Gyu Lee, Dae-Young Lee, Tae Joon Chung, Jin Won Choi 2013-06-04

Frequent Collaborators

Kyoung Jin Cha8 shared
Tae Gyeom Lee6 shared
Byung Rok Ahn6 shared
Gi Long Kim6 shared
Jong Ho Lee5 shared
Jin Won Choi4 shared

Nearby-Ranked Inventors

John Patrick Hickey, III12
Gregory Lutter12
Josselin Xavier COUPARD12
Xuan Li12
Nandana Mihindukulasooriya12
Keiichi Matsuda12
Robert Imig12
Peter Mage12
Sze Ping Ching12