Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142499 | Lead pin for package substrate | Ki Taek Lee, Sung Won Jeong, Gi Sub Lee, Jin Won Choi | 2015-09-22 |
| 8785789 | Printed circuit board and method for manufacturing the same | Boo Yang Jung, Dae-Young Lee, Jin Won Choi | 2014-07-22 |
| 8766450 | Lead pin for package substrate | Ki Taek Lee, Sung Won Jeong, Gi Sub Lee, Jin Won Choi | 2014-07-01 |
| 8708215 | Solder ball supplying apparatus | Yon Ho You, Jin Won Choi | 2014-04-29 |
| 8671564 | Substrate for flip chip bonding and method of fabricating the same | Tae Joon Chung, Dong Gyu Lee, Seon Jae Mun, Jin Won Choi | 2014-03-18 |
| 8651356 | Solder bump forming apparatus and soldering facility including the same | Noriaki Mukai, Dae-Young Lee, Jin Won Choi | 2014-02-18 |
| 8486760 | Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same | Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Seon Jae Mun | 2013-07-16 |
| 7893355 | Lead pin for package boards | Jin Won Choi | 2011-02-22 |