Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869718 | Multilayer capacitor and board having the same mounted thereon | Ah Young Lee, Chung Hyeon Ryu | 2024-01-09 |
| 11670452 | Multilayer electronic component | Chung Hyeon Ryu, Ah Young Lee | 2023-06-06 |
| 9142499 | Lead pin for package substrate | Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Jin Won Choi | 2015-09-22 |
| 8822841 | Package substrate and fabricating method thereof | Dong Gyu Lee, Jin Won Choi, Sung Won Jeong, Dae-Young Lee, Jin Ho Kim | 2014-09-02 |
| 8766450 | Lead pin for package substrate | Ki Taek Lee, Hueng Jae Oh, Sung Won Jeong, Jin Won Choi | 2014-07-01 |