Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8191750 | Apparatus for cutting a liquid crystal display panel and method thereof | — | 2012-06-05 |
| 8143727 | Adhesive on wire stacked semiconductor package | Kwang Seok Oh, Jong-Wook Park, Byoung-Youl Min | 2012-03-27 |
| 7863723 | Adhesive on wire stacked semiconductor package | Kwang Seok Oh, Jong-Wook Park, Byoung-Youl Min | 2011-01-04 |
| 7796958 | Transmitter and transmitting method thereof in wireless communication system | Hae-Moon Seo, Yeon-Kuk Moon, Kwang-Ho Won, Seong-Dong Kim | 2010-09-14 |
| 7783268 | Transmitter and transmitting method thereof in wireless communication system | Hae-Moon Seo, Yeon-Kuk Moon, Kwang-Ho Won, Seong-Dong Kim | 2010-08-24 |
| 7590391 | Digital intermediate frequency transmitter for wireless communication | Hae-Moon Seo, Yeon Kug Moon, Kwang-Ho Won, Seong-Dong Kim | 2009-09-15 |
| 7580478 | I/Q modulator using current-mixing and direct conversion wireless communication transmitter using the same | Hae-Moon Seo, Yeon-Kuk Moon, Kwang-Ho Won, Myung-Hyun Yoon, Seong-Dong Kim | 2009-08-25 |
| 7485490 | Method of forming a stacked semiconductor package | Kwang Seok Oh, Jong-Wook Park, Byoung-Youl Min | 2009-02-03 |
| 7260360 | Multi-band ZigBee transceiver supporting IEEE 802.15.4 wireless communication | Hae-Moon Seo, Kwang-Ho Won, Myung-Hyun Yoon, Jun Jae Yoo | 2007-08-21 |
| 6803254 | Wire bonding method for a semiconductor package | Byung Joon Han, Jae Dong Kim | 2004-10-12 |
| 6642610 | Wire bonding method and semiconductor package manufactured using the same | Byung Joon Han, Jae Dong Kim | 2003-11-04 |