Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057381 | Circuit board having laminated build-up layers | Chih-Chiang Lu, Hsin-Ning Liu, Jun-Rui Huang, Pei-Wei Wang, Ching-Sheng Chen | 2024-08-06 |
| 12052815 | Manufacturing method of circuit board | Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching-Shiang Chang, Ming-Ting Chang +3 more | 2024-07-30 |
| 11910535 | Printed circuit board stack structure and manufacturing method thereof | Ming-Hao Wu | 2024-02-20 |
| 11895773 | Circuit board structure | — | 2024-02-06 |
| 11859302 | Electroplating apparatus and electroplating method | Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan | 2024-01-02 |
| 11818833 | Circuit board structure | — | 2023-11-14 |
| 11785707 | Circuit board and manufacturing method thereof and electronic device | Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching-Shiang Chang, Ming-Ting Chang +3 more | 2023-10-10 |
| 11737206 | Circuit board structure | — | 2023-08-22 |
| 11686008 | Electroplating apparatus and electroplating method | Heng-Ming Nien, Chih-Chiang Lu, Cho-Ying Wu | 2023-06-27 |
| 11366381 | Mask structure and manufacturing method thereof | Pu-Ju Lin, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho | 2022-06-21 |
| 10999935 | Manufacturing method of circuit board | — | 2021-05-04 |
| 10820411 | Manufacturing method for circuit board and circuit board thereof | Zhe-Yong Lin, Li-Jie Liu, Ching-Sheng Chen | 2020-10-27 |
| 10813223 | Piezochromic stamp | — | 2020-10-20 |
| 10512166 | Manufacturing method of circuit board and stamp | — | 2019-12-17 |
| 10426038 | Manufacturing method of circuit board | — | 2019-09-24 |
| 10362682 | Manufacturing method of circuit board | — | 2019-07-23 |
| 10324370 | Manufacturing method of circuit substrate and mask structure and manufacturing method thereof | Pu-Ju Lin, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho | 2019-06-18 |
| 10271433 | Method of fabricating an electrical device package structure | Tzyy-Jang Tseng, Shu-Sheng Chiang, Tsung-Yuan Chen | 2019-04-23 |
| 10098234 | Manufacturing method of circuit board | — | 2018-10-09 |
| 9161454 | Electrical device package structure and method of fabricating the same | Tzyy-Jang Tseng, Shu-Sheng Chiang, Tsung-Yuan Chen | 2015-10-13 |
| 8955218 | Method for fabricating package substrate | Tsung-Yuan Chen | 2015-02-17 |
| 8604359 | Package substrate and fabrication method thereof | Tsung-Yuan Chen | 2013-12-10 |
| 7674672 | Fabricating process for substrate with embedded passive component | — | 2010-03-09 |
| 7441329 | Fabrication process circuit board with embedded passive component | — | 2008-10-28 |
| 7223687 | Printed wiring board and method of fabricating the same | Chung W. Ho, Leo Shen | 2007-05-29 |