HL

Hsin-Ning Liu

UT Unimicron Technology: 1 patents #166 of 284Top 60%
Overall (All Time): #2,519,978 of 4,157,543Top 65%
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Patent #TitleCo-InventorsDate
12057381 Circuit board having laminated build-up layers Chih-Chiang Lu, Jun-Rui Huang, Pei-Wei Wang, Ching-Sheng Chen, Shih-Lian Cheng 2024-08-06