Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485863 | Carrier and method for fabricating coreless packaging substrate | Tzyy-Jang Tseng, Chung W. Ho, Dyi-Chung Hu, Huan-Ling Lee | 2016-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485863 | Carrier and method for fabricating coreless packaging substrate | Tzyy-Jang Tseng, Chung W. Ho, Dyi-Chung Hu, Huan-Ling Lee | 2016-11-01 |