| 8575954 |
Structures and processes for fabrication of probe card assemblies with multi-layer interconnect |
William R. Bottoms, Erh-Kong Chieh, Nim C. Lam |
2013-11-05 |
| 7952373 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
Sammy Mok |
2011-05-31 |
| 7884634 |
High density interconnect system having rapid fabrication cycle |
Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin, Sammy Mok +3 more |
2011-02-08 |
| 7872482 |
High density interconnect system having rapid fabrication cycle |
Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin, Sammy Mok +3 more |
2011-01-18 |
| 7812626 |
High density interconnect system for IC packages and interconnect assemblies |
Wilmer R. Bottoms, Sammy Mok, Douglas N. Modlin |
2010-10-12 |
| 7772860 |
Massively parallel interface for electronic circuit |
Sammy Mok |
2010-08-10 |
| 7621761 |
Systems for testing and packaging integrated circuits |
Sammy Mok, Roman Milter |
2009-11-24 |
| 7579848 |
High density interconnect system for IC packages and interconnect assemblies |
Wilmer R. Bottoms, Sammy Mok, Douglas N. Modlin |
2009-08-25 |
| 7403029 |
Massively parallel interface for electronic circuit |
Sammy Mok |
2008-07-22 |
| 7382142 |
High density interconnect system having rapid fabrication cycle |
Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin, Sammy Mok +3 more |
2008-06-03 |
| 7349223 |
Enhanced compliant probe card systems having improved planarity |
Joseph Haemer, Douglas N. Modlin |
2008-03-25 |
| 7247035 |
Enhanced stress metal spring contactor |
Sammy Mok, Roman Milter |
2007-07-24 |
| 7137830 |
Miniaturized contact spring |
Syamal Kumar Lahiri, Frank Swiatowiec, Sammy Mok, Erh-Kong Chieh, Roman Milter +4 more |
2006-11-21 |
| 7138818 |
Massively parallel interface for electronic circuit |
Sammy Mok |
2006-11-21 |
| 7126358 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
Sammy Mok |
2006-10-24 |
| 7126220 |
Miniaturized contact spring |
Syamal Kumar Lahiri, Frank Swiatowiec, Sammy Mok, Erh-Kong Chieh, Roman Milter +4 more |
2006-10-24 |
| 7009412 |
Massively parallel interface for electronic circuit |
Sammy Mok |
2006-03-07 |
| 6917525 |
Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
Sammy Mok, Frank Swiatowiec, Syamal Kumar Lahiri, Joseph Haemer |
2005-07-12 |
| 6815961 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
Sammy Mok |
2004-11-09 |
| 6812718 |
Massively parallel interface for electronic circuits |
Sammy Mok |
2004-11-02 |
| 6799976 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
Sammy Mok |
2004-10-05 |
| 6791171 |
Systems for testing and packaging integrated circuits |
Sammy Mok |
2004-09-14 |
| 6710609 |
Mosaic decal probe |
Sammy Mok, Ira Feldman |
2004-03-23 |
| 5973504 |
Programmable high-density electronic device testing |
— |
1999-10-26 |
| 4480318 |
Method of programming of junction-programmable read-only memories |
— |
1984-10-30 |